Labels Milestones
Back10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads THT DIP DIL ZIF 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing.
- (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with kicad-footprint-generator Molex.
- -4.566418e-001 7.828570e-001 4.226265e-001 facet normal -0.989341.
- -0.0570902 0.994847 vertex 6.47614 4.70519 19.9505 facet normal.