Labels Milestones
Back16-Lead Quad Flat, No Lead Package - 9x9 mm Body [TSSOP] with exposed pad 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 6x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf.
- MK_VCO/Panels/Font files/Futura XBlk BT.ttf create mode 100755 Panels/FireballSpell.png.
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