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Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator JST XA series connector, S04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 5, Wuerth electronics 9774110360 (https://katalog.we-online.de/em/datasheet/9774110360.pdf), generated with kicad-footprint-generator JST ZE series connector, B12B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package LFCSP (5mm x 5mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator JST PH series connector, 502382-0270 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-E (7360-38 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator JST SHL series connector, B3P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 10.6, Wuerth electronics 9774060960 (https://katalog.we-online.de/em/datasheet/9774060960.pdf,), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf 8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.5mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see.

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