Labels Milestones
BackPG-DSO 12 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead.
- -0.436801 -0.865139 0.246453 facet normal -0.0845144 -0.0158156.
- 4.63032 6.92976 5.74921 facet normal -0.192821 -0.747983 0.635092.