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Https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier case 15.7x15.7 Single phase bridge rectifier case 16.7x16.7 Vishay GBU rectifier package, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length, 1x10, 5.08mm pitch, see http://www.vishay.com/docs/88655/kbl005.pdf Vishay KBL rectifier diode bridge OnSemi SDIP-4L, see https://www.onsemi.com/pdf/datasheet/df10s1-d.pdf OnSemi Diode Bridge SDIP-4L SMD diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf SMD package RGB LED NeoPixel, https://cdn-shop.adafruit.com/datasheets/WS2812B.pdf Wurth Common anode RGB LED, https://assets.cree-led.com/a/ds/h/HB-CLV1A-FKB.pdf LED Cree PLCC-4 2020 CLMVB-FKA CLMVC-FKA 3.2mm x 2.8mm PLCC4 RGB LED, clear, SMD, https://www.lumex.com/spec/SML-LX0303SIUPGUSB.pdf Lumex RGB LED, http://www.inolux-corp.com/datasheet/SMDLED/Addressable%20LED/IN-PI554FCH.pdf LED RGB NeoPixel Mini 'Piranha' RGB LED, clear, SMD, https://www.lumex.com/spec/SML-LX0303SIUPGUSB.pdf Lumex RGB LED, through hole, DF11-30DP-2DSA, 15 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xxx-DV-BE, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SUR series connector, B14B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42820-52XX, 5 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator connector Molex Nano-Fit Power Connectors, 105313-xx04, 4 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1030, 10 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf.

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