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BackWith Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for SSR made by Sharp Solid State relais SSR Sharp Sanyo SIP-15, 78.0mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3471fb.pdf#page=15), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm 75ohm Relay, 1-Form-A, Schrack-RYII, RM5mm, SPST-NC Relay.
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