Labels Milestones
Back8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 2x38 2.54mm double row surface-mounted straight socket strip, 2x21, 2.00mm pitch, double rows Through hole angled pin header SMD 1x20 2.00mm single row Through hole angled socket strip, 1x08, 2.00mm pitch, single row Through hole straight socket strip, 1x06, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x21, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x26 2.54mm double row surface-mounted straight pin header, 1x39, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled.