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With feed through strain relief, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator XP_POWER IA48xxD DIP DCDC-Converter XP_POWER IA48xxS, SIP, (https://www.xppower.com/pdfs/SF_IA.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (JEDEC MO-153 Var FE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN-20 4.5mm 2.5mm 0.5mm WQFN, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf), generated with kicad-footprint-generator JST PHD series connector, S2B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, SM13B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator connector Hirose DF11 through hole, DF13-06P-1.25DSA, 6 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0710, with PCB locator, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA series connector, B07B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator connector wire 0.25sqmm strain-relief Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3.

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