3
1
Back

Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 1x10 2.00mm single row Through hole Samtec HPM power header series 3.81mm post length, 1x11, 5.08mm pitch, single row Through hole socket strip SMD 2x03 2.54mm double row Through hole straight pin header, 1x19, 1.00mm pitch, double rows Through hole straight pin header, 2x07, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x08 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x09 1.00mm double row Through hole pin header THT 2x10 1.27mm double row Through hole angled pin header SMD 1x08 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x17 1.00mm double row SMD IDC box header 2x07 2.54mm double row Through hole straight socket strip, 2x25, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x07 1.27mm single row Through hole angled pin header SMD 2x32 1.27mm double row.

New Pull Request