Labels Milestones
BackSize 7x7.6mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type059_RT06306HBWC, 6 pins, single row Surface mounted socket strip THT 1x32 2.00mm single row style1 pin1 left Surface mounted socket strip THT 1x15 2.54mm single row Through hole IDC header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header THT 1x35 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x35 1.00mm single row male, vertical entry Harwin LTek Connector, 8 pins, pitch 2.5mm, size 5.5x5mm^2, drill diamater 1.15mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-EZmate side entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-142 , 12 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [QFN]; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump.