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[TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 5.45mm TO-264-3, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-4 Vertical RM 5.08mm TO-220F-2, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Single phase bridge rectifier, https://www.bourns.com/docs/Product-Datasheets/CD-DF4xxSL.pdf Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7812045, 20 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770973-x, 7 Pins.

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