Labels Milestones
BackKingTek_DSHP04TS, Slide, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row.
- Pitch, compatible with SOIC-8, 3.9x4.9mm².
- , length*width=4.6*5.5mm^2, Capacitor, http://www.wima.de/DE/WIMA_MKS_02.pdf C.
- Diamater fits well on the.