Labels Milestones
BackStrip, HLE-110-02-xxx-DV-BE-LC, 10 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5566-04A, example for new mpn: 39-29-4109, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-135-02-xxx-DV-BE, 35 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-11, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Single phase bridge rectifier case 15.1x15.1mm, pitch 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 2.54mm IIPAK I2PAK TO-264-2, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 5.45mm TO-3PB-3, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220-4, Horizontal, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 2.54mm TO-220-5, Horizontal, RM 2.286mm SIPAK, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 2.54mm TO-247-5, Horizontal, RM 2.54mm, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 1.7mm staggered type-2 TO-220-7, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220-9 Horizontal RM 2.54mm staggered type-2 TO-220F-5, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 5.08mm TO-126-3, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 0.9mm staggered type-2 TO-220F-15 Vertical RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads in-line, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-9, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD DIP Switch SPST Slide 7.62mm 300mil.
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