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14-lead dip package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket.

• Vias included, (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf.
• 5.08mm 4W length 18mm diameter 9mm width.
• 1.04186 6.43 13.35 vertex 1.
• HDI, Wire-to-Board, Fully Shrouded, Vertical Header: https://www.te.com/usa-en/product-440054-2.datasheet.pdf.

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