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Ethernet cat5 1 Port RJ45 8P8C receptacle, shielded, with magnetics, through hole, DF11-22DP-2DSA, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector JST SH series connector, S04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST VH PBT series connector, SM08B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Stocko MKS 16xx TE, 1-826576-3, 13 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-N (7343-30 Metric), IPC_7351 nominal, (Body size source: https://www.susumu.co.jp/common/pdf/n_catalog_partition07_en.pdf), generated with kicad-footprint-generator JST PH series connector, 53398-1371 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2102, With thermal vias 10-Lead Plastic Dual Flat No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-108-02-xxx-DV-LC.

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