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62cb30efbfdab918bafabca8d6c9cca52ce95eca Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete 'Panels/futura light bt.ttf' Panels/futura medium condensed bt.ttf | Bin 0 -> 10724 bytes .../Panels/MAGIC MISSILE VCF.png and /dev/null differ main MK_VCO/Fireball/Fireball.kicad_pcb 35767 lines da12ac6a39 Delete '3D Printing/Panels/FIREBALL VCO.png' da12ac6a39 Delete '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png' .../Panels/MAGIC MISSILE VCF.png differ v1.1 Go to file 6523065365 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B14B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, through hole 4.5mm, height.

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