Labels Milestones
BackFlat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100.
- Series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf, hand-soldering, 2.0x1.2mm^2 package.
- Http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module.
- Length*diameter=12*9.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf C Axial series.