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Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline (ST)-4.4 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf), generated with kicad-footprint-generator JST PH series connector, SM02B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Hirose DF63 vertical Hirose series connector, B20B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with.

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0.0974075 0.989345 0.108204 facet normal 7.274189e-01.
0.0393247 facet normal -9.938602e-001.
Raster staggered array, 1.403x1.555mm package, pitch.
[TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87.

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