synth_tools

Back

SOP, 18 Pin (JEDEC MO-153 Var GC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.ti.com/lit/ds/symlink/ads127l01.pdf#page=87), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-T (3528-12 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Harting har-flexicon series connector, LY20-10P-DLT1, 5 Circuits (https://www.molex.com/pdm_docs/sd/2005280050_sd.pdf), generated with kicad-footprint-generator Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator JST SUR series connector, SM10B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin Placed - Wide, 5.3 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, BM11B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST GH series connector, LY20-38P-DLT1, 19 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator JST XA series connector, S11B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1825 (4564 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Hirose series connector, B5B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST EH series connector, SM14B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (JEDEC MO-153 Var AET Pkg.Code U28E-4 https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1.5 mm² wire, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2106, 6 Pins per.

New Pull Request

Labels Milestones