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0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 1.27mm staggered type-1 TO-220-4, Vertical, RM 1.27mm, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220F-2, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 2.54mm staggered type-2 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 8.9 mm (350 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 1x12 1.27mm single row Through hole pin header SMD 1x35 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x17 2.54mm single row style2 pin1 right Through hole angled socket strip, 1x13, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x36, 1.00mm pitch, double rows Through hole angled pin header THT 2x40 2.00mm double row Through hole straight pin header, 2x01, 2.54mm pitch, 6mm pin length, single row 0.8 mm Highspeed card edge connector for PCB's with 70 contacts (not polarized Highspeed card edge connector for PCB's with 40 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 70 contacts (not polarized Highspeed.

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