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Package (UC) - 3x3x0.5 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [QFN] with thermal vias 10-Lead Plastic Micro Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout.

• Vertex 5.25893 4.75047 6.95295 vertex.
• 2 Gauge, Massstab, 50mm.
• Covered Software, or under the terms of Section.
• Electronics 9774015243 (https://katalog.we-online.de/em/datasheet/9774015243.pdf), generated.

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