Labels Milestones
BackB6PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator connector JST SH series connector, S11B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector Molex SL vertical Molex KK 396 Interconnect System, old/engineering part number: 5273-09A example for new part number: 26-60-5110, 11 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63-5P-3.96DSA, 5 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py HVQFN, 24 Pin (https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49), generated with kicad-footprint-generator Molex LY 20 series connector, B9B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.65mm pitch (http://www.akm.com/akm/en/file/datasheet/CQ-330J.pdf AKM CZ-381x current sensor, 5.6x7.9mm body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-Lead Plastic DFN (5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to shell ground, but not to front panel 24ca7abc85 Added schmancy pcb for v2 front panel 24ca7abc85681936397a2802c8155420fcaf679c Added schmancy pcb for v2 front panel than usual. At least it is a ceramic 104 power cap like C5, C6, C8, C9 | 5 create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_LED_Hole_NPTH.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel.gbrjob create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Mounting_Holes_NPTH.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr create mode 100644 3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl Normal file Unescape "Name": "Top Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file View File Schematics/Fireball.kicad_sch Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Switch_Hole_NPTH.kicad_mod Normal file Unescape Synth Mages Power Word Stun Panel.kicad_prl 78 lines if (preg_match("@.*(
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