Labels Milestones
BackStrip, 2x49, 1.27mm pitch, double rows Through hole angled socket strip THT 2x34 2.00mm double row Through hole IDC header, 2x13, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x15, 2.00mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length THT 1x16 1.27mm single row Through hole socket strip SMD 1x29 2.00mm single row male, vertical entry, PN:G125-FVX1605L0X Harwin Gecko Connector, 34 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf QFN, 64 Pin (http://www.ti.com/lit/ds/symlink/tusb8041.pdf#page=42), generated with kicad-footprint-generator ipc_noLead_generator.py VSON, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad TSSOP, 14 Pin (JEDEC MO-153 Var DE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV, 12 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Micro Leadframe Package, 16 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 16 pin with exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin without exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad Micrel MLF, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0280, 28 Circuits (https://www.molex.com/pdm_docs/sd/2005280280_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV-BE-LC, 14 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xxx-DV-BE-A, 27 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py VQFP, 176 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 4, Wuerth electronics 97730456334 (https://katalog.we-online.com/em/datasheet/97730456334.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B09B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1105, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.75.
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