3
1
Back

3x3 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad LQFP, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-4)), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 14, Wuerth electronics 9774020982 (https://katalog.we-online.de/em/datasheet/9774020982.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board.

New Pull Request