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28.55x28.55mm, case KBPC_T(FP), https://www.diodemodule.com/bridge-rectifier/kbpc/kbpc1501t.pdf Single phase, Bridge rectifier, 28.55x28.55mm, case KBPC_T(FP), https://www.digitroncorp.com/Digitron/media/Files/Datasheets/KBPC15005-SERIES.pdf Single phase, Bridge Rectifier, 28.55x28.55mm, case KBPC_W(WP), https://www.diodemodule.com/bridge-rectifier/kbpc/kbpc15005w.pdf 128x32 LCD with RGB backlight https://www.newhavendisplay.com/specs/NHD-C12832A1Z-FSRGB-FBW-3V.pdf EPCOS/TDK Electronics/Qualcomm DCC6c SAW filter package, https://www.golledge.com/media/3785/mp08167.pdf 8-pin 3.8x3.8mm SAW filter, https://www.golledge.com/media/1831/ma05497.pdf Compact PCB mounting EMI filter (https://www.schaffner.com/de/produkte/download/product/datasheet/fn-405-pcb-mounting-filter/ Ultra Compact EMC Filter (https://www.schaffner.com/products/download/product/datasheet/fn-406-ultra-compact-emc-filter/ Fuse SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator JST SH series connector, B4P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [QFN]; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix.

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