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(see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB cutout, light-direction downwards, see http://www.everlight.com/file/ProductFile/ITR8307.pdf refective opto couple photo coupler IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for diode bridges, row spacing 10.16 mm (400 mils), Socket THT DIP DIL ZIF 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL ZIF 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL ZIF 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338.

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