Labels Milestones
BackCSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 18 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 483, 3.73x4.15mm, 115.
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- CC0 or use pieces.