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Via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf) according to land-pattern PL-005, including GND vias.

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