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THT 1x02 1.00mm single row style2 pin1 right Through hole IDC header, 2x08, 1.00mm pitch, double rows Through hole angled pin header, 2x38, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole angled pin header, 1x12, 2.00mm pitch, double rows Through hole angled pin header, 2x31, 1.27mm pitch, double rows Surface mounted pin header SMD 1x03 1.00mm single row Through hole angled pin header SMD 2x32 2.54mm double row Through hole straight pin header, 2x28, 1.27mm pitch, single row Through hole straight pin header, 2x12, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x36 2.54mm double row Through hole angled pin header, 1x01, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 4 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxS SIP DCDC-Converter XP_POWER IAxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IA.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.15 mm² wires, basic insulation.

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