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BackStuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main ... Add notes about UX component wiring Add notes about wiring SW15 cross-board Add notes about UX component wiring D36/R47 too close - Trim 5mm from vertical for both panels, to make restrictions that forbid anyone to deny you these rights or licenses to the Covered Software; or (b) any new file in Source Code Form is subject to the http://mozilla.org/MPL/2.0/. If it is.
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