Labels Milestones
BackSocket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), missing pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 16-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MU MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry connector Molex Pico-Clasp series connector, S08B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1.
- Sot505-1_po.pdf TSSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated.
- Type 3xAA battery CR1225 coin cell vertical.