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BackDCB Package 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Shrink Small Outline (SO) - Wide, 7.50 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506AH.PDF DFN, 6 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=11791&prodName=TLP185), generated with kicad-footprint-generator Hirose DF11 through hole, DF63-6P-3.96DSA, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST XA series connector, B10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5566-14A, example for new part number: A-41792-0008 example for new part number: 26-60-5170, 17 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf.
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