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License from the ages Samurai Latest commits for file Panels/title_test_36.stl Latest commits for file Schematics/LUTHERS_VCO.diy Update luther's layout Drill report for precadsr-panel.kicad_pcb Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file View File Panels/Font files/futura medium bt.ttf Latest commits for branch new_footprints Final revision; added custom DRC as project file Fireball/Fireball.kicad_dru main synth_tools/Schematics/SynthMages.pretty/SLIDE_POT_0547.kicad_mod 84 lines tstamp 189e5c14-d81a-45a9-b8ba-c69582490088) Final revision; added custom DRC as project file tstamp 1c9c2c29-57db-4a4e-bbff-29f893ea0430) Final revision; added custom DRC as project file c4e1c30b9b Add jlc constraints DRC; replace order number text replaces FIREBALL mask/etch with silkscreen Latest commits for file Schematics/Rampage_V1_4_Sch.pdf Latest commits for branch fewer_panel_wires Move LED resistors From d81094c64ef3dbd9cdcdc0341bc85fcc9deb080e Mon Sep 17 00:00:00 2001 .../Panels/SPIDER CLIMB.png | Bin 0 -> 445539 bytes Images/precadsr-panel-holes.png | Bin 0 -> 46787 bytes Datasheets/tl074.pdf | Bin 0 -> 167187 bytes Images/PXL_20210831_002553634.jpg | Bin 0 -> 1219781 bytes ....32 - a 10-step panel layout ideas Initial stab at a 10-step panel layout ideas Experimenting with more panel layout 3bfacc0b86 Add main pdf Add main pdf Add main pdf Add main pdf Add main pdf Add main pdf UI: 11 potentiometers 13 SPDT switches: // 1 hp from side to center of package, Thorlabs photodiodes TO-46-3, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad with vias HTSSOP, 20 Pin (JEDEC MO-153 Var BE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wire, basic insulation, conductor diameter 0.5mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py.

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