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1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip SMD 1x17 1.00mm single row Through hole angled pin header THT 2x32 2.54mm double row Through hole IDC header, 2x13, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x11 1.27mm double row Through hole socket strip THT 1x05 2.54mm single row Through hole angled pin header, 1x25, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x35 1.27mm double row Through hole socket strip THT 1x30 2.54mm single row Through hole angled pin header, 2x10, 2.54mm pitch, 6mm pin length, double rows.

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