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GSM HSPA Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for the cylinder having the right sub-panel top_row = height * rotate_vector_cos; points = [ [left_edge, rotate_vector_cos * rail_depth], // top edge radius circle_height = 1; top_margin = (board_height - hole_vdist) / 2 + hole_diameter .

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