Labels Milestones
BackSPST Omron_A6S-610x, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x21.88mm 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 40-lead though-hole.
- Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator.
- Http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, 12.7x5.1mm^2 package SMD.
- Package width=2.5mm, 3 pins IR-LED, diameter 3.0mm.
- BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0130, 13.