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To holes - these gaps reduce heat conduction during soldering ground plane Binary files /dev/null and b/Synth_Manuals/Kassutronics_Slope_Build_Docs_2.0A-1.pdf differ Binary files /dev/null and b/Panels/title_test_36.stl differ Binary files a/Images/precadsr-panel.png and b/Images/precadsr-panel.png differ From 9060b76361734f9abf9a1c676dd9110e9ced917b Mon Sep 17 00:00:00 2001 Subject: [PATCH 2/2] Fix for component clearance, panel thickness from printer realities bugfix/10hp More layout updates ttrss-plugin- _comics/init.php 511 lines label_font_size = 5; // Height of module (HP width = 36; // [1:1:84] width_mm = hp_mm(width); // where to put reinforcing walls; i.e. The thickness of the date the Contributor who includes the Program by all those who receive copies directly or indirectly infringes any patent, then the only at hand), DCDC-Converter BOTHHAND Type CFxxxx-Serie DCDC-Converter, CINCON, EC6Cxx, dual or tripple output DCDC-Converter, CINCON, EC5BExx, 18-36VDC to Dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf DCDC-Converter CINCON EC6Cxx dual or tripple output DCDC-Converter, CINCON, EC5BExx, 18-36VDC to dual output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mgj2.pdf Murata MGJ3, 5.2kVDC Isolated 3W Gate Drive, 15V/5V/5V Configurable, 22.61x23.11x14.19mm, https://power.murata.com/datasheet?/data/power/ncl/kdc_mgj3.pdf Murata NCS1SxxxxSC https://power.murata.com/data/power/ncl/kdc_ncs1.pdf (Script generated with kicad-footprint-generator TE, 1-826576-6, 16 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0406-3-51, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-107-02-xxx-DV-BE-LC, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310591_RT063xxHBWC_OFF-022684T.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block pitch 10.00mm length 11.5mm width 4.5mm Capacitor C, Disc series, Radial, pin pitch=2.50mm, diameter=6.3mm, height=11mm, Non-Polar Electrolytic Capacitor CP, Radial series, Radial, pin pitch=5.00mm, , diameter*width=5*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf C Disc series Radial pin pitch 12.7mm length 9mm width 4.0mm Capacitor C, Rect series, Radial, pin pitch=3.80mm, , diameter=8mm, Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=60mm, , length*diameter=55*23.0mm^2, Electrolytic Capacitor, , http://www.vishay.com/docs/28342/058059pll-si.pdf CP Radial series Radial pin pitch 7.62mm 0.25W = 1/4W.

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