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32-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST , Slide, row spacing.

• Maxim TDFN, 6 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=11791&prodName=TLP185), generated with kicad-footprint-generator.
• 53261-1471 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100.
• 0.615699 0.52587 0.586835 facet.

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