X="3.8" y="2.1"/> Update luther's layout Update luther's layout Update luther's layout footprint "P160_pot_hole_nonpcb" (version 20221018) (generator pcbnew Latest commits for file Panels/fireball_vco_14hp_v1.scad adds front panel 82024e96c9 updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flat, No Lead Package (ML) - 8x8x0.9 mm Body with Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline (SO) - Wide, 7.50 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size 10.8x21.88mm 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 25.4.
alt
click/enter