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RND 205-00074, 9 pins, pitch 5.08mm, size 20.3x9.8mm^2, drill diamater 1.3mm, pad diameter 2mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, B4P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1 mm² wires, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ with flat with hole, hole diameter 1.0mm Keystone Miniature THM Test Point 5000-5004, http://www.keyelco.com/product-pdf.cfm?p=1309 Through Hole 10/100 Base-T, AutoMDIX, https://www.amphenolcanada.com/ProductSearch/Drawings/AC/RJMG1BD3B8K1ANR.PDF RJ45 Vertical Shield LED Green 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Green 5381 Series LED Yellow 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Green 5381 Series LED A20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 5.24x5.24mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm pad, based on the other Ground planes: ground planes are copper fill applied everywhere there isn't a trace already use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering - ground planes connect to holes - disable for projection From ad96459571a569a983e452184e49702fe8779c4e Mon Sep 17 00:00:00 2001 Subject: [PATCH] light tweaks checkpoint after roughing out middle PCB .../Unseen Servant/Unseen Servant.kicad_sch | 30 .../Panel/precadsr-panel/precadsr-panel.sch | 259 Hardware/Panel/precadsr_panel.png | Bin 0 -> 38860 bytes Panels/futura medium condensed bt.ttf | Bin 0 -> 38860 bytes Panels/Font files/futura light bt.ttf | Bin 11930 -> 0 bytes.

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