synth_tools

Back

FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-5-11/ TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ D2PAK DDPAK TO-263 D2PAK-7 TO-263-7 SOT-427 TO-263 / D2PAK / DDPAK SMD package, orientation marker at anode, https://dammedia.osram.info/media/resource/hires/osram-dam-5824137/SFH%204257_EN.pdf LED PLCC-2 SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package RGB LED NeoPixel, https://cdn-shop.adafruit.com/product-files/2686/SK6812MINI_REV.01-1-2.pdf LED RGB NeoPixel addressable PLCC-4 5050 5.0mm x 5.0mm PLCC4 LED 4.7mm x 1.5mm PLCC6 LED, http://www.cree.com/led-components/media/documents/1381-QLS6AFKW.pdf Cree XHP50, 6V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP70 LED, 12V version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf LED Cree-XQ handsoldering pads http://www.cree.com/~/media/Files/Cree/LED-Components-and-Modules/XLamp/Data-and-Binning/ds-XQB.pdf LED SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOT, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2020-6%20(Type%20C).pdf), generated with kicad-footprint-generator.

New Pull Request

Labels Milestones