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(ML) - 8x8x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 1.0.

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