3
1
Back

Package (JQ) - 4x4x0.5 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch, JS series, DPDT, right angle, PTS645VL39-2 LFS tactile switch SPST right angle, PTS645VL83-2 LFS C&K Button tactile switch Omron B3F right angle stacked dual USB 3.0, type A, right angle stacked dual USB 3.0, type A, Horizontal, https://www.molex.com/pdm_docs/sd/676433910_sd.pdf USB_A Female.

New Pull Request