Labels Milestones
Back400 0.8 CLG400 CL400 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x03 5.08mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x12 1.00mm single row style2 pin1 right Through hole straight socket strip, 1x06, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x24 1.27mm double row Through hole straight pin header, 2x02, 2.00mm pitch, double rows Through hole horizontal IDC box header THT 2x33 1.27mm double row surface-mounted straight pin header, 1x39, 2.00mm pitch, single row Surface mounted pin header SMD 1x10 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x07 1.27mm single row Surface mounted pin header THT 1x25 1.00mm single row style2 pin1 right Through hole socket strip THT 1x36 2.00mm single row Surface mounted socket strip THT 2x11.
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