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Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.5mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf7045_en.pdf Inductor, TDK, SLF7032, 7.0mmx7.0mm (Script generated with kicad-footprint-generator Mounting Hardware, external M3, height 10, Wuerth electronics 9774050360 (https://katalog.we-online.de/em/datasheet/9774050360.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x21.88mm 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 2.54 4-lead dip package for Kodenshi SG-105 with PCB locator, 13 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89012xx, 12 Pins.

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