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BGA (based on standard DIP-4), row spacing 22.86 mm (900 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body.

• Images/PXL_20210831_000922493.jpg 4579d541a8 Adding SynthMages footprint library.
• Vertex -1.006624e+02 9.249908e+01 2.550000e+00 facet.
• Normal 4.557469e-001 -7.833775e-001 4.226281e-001 vertex.

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