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600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x17.42mm.

• 3.347x3.585mm package, pitch 0.4mm; see section 6.1.
• ST WLCSP-20, ST die ID 464, 2.58x3.07mm.
• -10.1904 2.19603 facet normal.

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