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9774060943 (https://katalog.we-online.de/em/datasheet/9774060943.pdf), generated with kicad-footprint-generator JST XA series connector, S38B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-172 , 12 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Molex MicroClasp side entry JST ZE series connector, B3B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, S10B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Inductor SMD 1806 (4516 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade Connector System, 53048-1210, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 19.9x23.6x2.65mm, https://www.quectel.com/UploadImage/Downlad/M95_Hardware_Design_V1.3.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl079.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-236, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-230, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for Mini-Circuits case HQ1157 (https://www.minicircuits.com/case_style/HQ1157.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4.

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