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BackGaps reduce heat conduction during soldering ground plane created pull request 'More schematics' (#3) from schematic by Eeschema 5.1.9-73d0e3b20d~88~ubuntu20.04.1 Generated from schematic into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/3.
- HLE-130-02-xxx-DV-A, 30 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Molex.
- (end 170.76005 108.25 (end.