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YFF S-XBGA-N5 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header SMD 1x30 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x23 2.00mm double row Through hole angled pin header, 2x18, 2.54mm pitch, single row Through hole straight socket strip, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x06, 1.00mm pitch, double rows Through hole straight socket strip, 1x12, 2.00mm pitch, double rows Through hole straight socket strip, 2x38, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x23 2.00mm double row Through hole straight Samtec HPM power header series 3.81mm post length, 1x14, 5.08mm pitch, single row Surface mounted socket strip SMD 1x26 2.54mm single row Through hole angled pin header, 2x03, 2.54mm pitch, 8.51mm socket length, single row Through hole pin header THT 2x20 1.00mm double row surface-mounted straight pin header, 2x07, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x26, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x17 2.00mm double row Through hole angled socket strip THT 2x20 2.00mm double row Through hole angled pin header THT 2x40 1.27mm double row Through hole angled pin header, 1x01, 2.00mm pitch, single row Through hole angled socket strip, 2x39, 1.00mm pitch, double rows.

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